Integrated circuit with configurable on-die termination

ABSTRACT

Described are integrated-circuit die with differential receivers, the inputs of which are coupled to external signal pads. Termination legs coupled to the signal pads support multiple termination topologies. These termination legs can support adjustable impedances, capacitances, or both, which may be controlled using an integrated memory.

FIELD

The subject matter presented herein relates generally to the field ofcommunications, and more particularly to high speed electronic signalingwithin and between integrated circuit devices.

BACKGROUND

High-speed data communication integrated circuit (IC) dies are known toinclude both drivers and receivers. The driver of one such IC connectsto the receiver of another via one or more signal transmission lines.Both the driver and receiver circuits include termination elements thatattempt to match the characteristic impedance of the transmission lineto the output impedance of the driver and input impedance of thereceiver, as impedance mismatches degrade signal quality andconsequently reduce communication speed and reliability.

Some conventional communication systems employ control systems thatcalibrate the impedance of on-die termination (ODT) elements forimproved impedance matching. These systems work well in manyapplications. Still, high-speed data communication circuits often mustachieve ever-greater performance levels, at competitive prices, tosatisfy customer demand. Furthermore, different customers typically havedifferent requirements that may not be met by a given ODT configuration.One customer might favor power-efficiency over speed, or may preferdifferent termination voltages or impedances. There is therefore a needfor ODT circuits that offer customers access to a broader range oftermination topologies and values.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter presented herein is illustrated by way of example,and not by way of limitation, in the figures of the accompanyingdrawings and in which like reference numerals refer to similar elementsand in which:

FIG. 1 depicts an integrated-circuit die 100 that includes configurableon-die termination in accordance with one embodiment.

FIG. 2 depicts a communication system 200 that employs configurableon-die termination in accordance with another embodiment.

FIG. 3 depicts an IC die 300 in accordance with another embodiment.

FIG. 4 depicts a communication system 400 that employs configurable ODTcircuitry in accordance with another embodiment.

FIG. 5 depicts a communication system 500 in accordance with yet anotherembodiment.

FIG. 6 depicts a configurable RC circuit 600 that can be used in placeof the third termination leg of die 510 of FIG. 5, which extends betweennode 535 and ground.

DETAILED DESCRIPTION

FIG. 1 depicts an integrated-circuit (IC) die 100 in accordance with oneembodiment. Die 100 includes a pseudo-differential receiver 105 thatcompares an input signal RXi, received via a pad 110, with a referencevoltage Vref on a like-named voltage terminal or node to produce anoutput signal RXo. Die 100 also includes programmable on-die termination(ODT) circuitry 115 that can be programmed to provide either of twocommon termination topologies for high-speed communications: theso-called “rail-to-rail” topology and the so-called “half-supply”topology. The choice of termination topology is then left to thediscretion of the user of IC die 100. An external source or internalmemory 120 can deliver a signal S/P to temporarily or permanently selectone of the two configurations.

ODT circuitry 115 includes two termination legs extending from thecommunication port between pad 110 and receiver 105. The uppertermination leg includes a first termination impedance 125 and a firsttermination switch 130. Switch 130 includes three switch nodes, two ofwhich are connected to supply voltage Vodt and reference voltage Vref,respectively. The third switch node is coupled to the communication portvia termination impedance 125. The lower termination leg includes asecond termination impedance 135 and a second termination switch 140similar to switch 130. Two switch nodes of switch 140 are connected toground and reference voltage Vref, respectively, while the third iscoupled to the communication port via termination impedance 135. Bothswitches 130 and 140 are two position switches responsive to signal S/Pfrom memory 120 to selectively couple one of the first and second switchnodes to the third switch node.

In rail-to-rail or serial terminations, the communication channel iscoupled to each of two opposite supply voltages via a pair oftermination impedances. To select a rail-to-rail termination topology,switches 130 and 140 are switched to supply nodes Vodt and ground,respectively. In that case, the input terminal to receiver 105 iscoupled to Vodt and ground via respective impedances 125 and 135.Termination voltage Vodt on the like-named supply node is supply voltageVdd in some embodiments, but may be a different fixed voltage or avariable voltage in other embodiments.

In half-supply or parallel terminations, the communication channel iscoupled to a reference voltage between the two supply voltages. Toselect a half-supply termination topology, switches 130 and 140 are bothswitched to voltage Vref, in which case the input terminal to receiver105 is coupled to the reference voltage terminal Vref via parallelimpedances 125 and 135. As the name implies, the reference voltage inhalf-supply terminations is typically half the difference between thevoltages on the supply nodes (e.g., Vref=½(Vdd−Gnd)), but voltage Vrefmay be a different fixed voltage or a variable voltage in otherembodiments.

IC die 100 optionally includes a coupling switch 145 between pad 110 andthe input terminal of receiver 105. An external or internal signal, suchas from memory 120, can deliver a signal AC/DC to temporarily orpermanently open or close switch 145. When switch 145 is closed,receiver 105 is DC coupled to pad 110: when open, receiver 105 is ACcoupled to pad 110 via a capacitor 150.

Impedances 125 and 135 may be adjustable and capable of calibration.Suitable calibration methods and circuits are detailed in U.S. Pat. No.6,924,660 entitled “Calibration Methods and Circuits for OptimizedOn-Die Termination,” which is incorporated herein. Switches 130, 140,and 145 can be fashioned of transistors, as is well understood by thoseof skill in the art. Capacitor 150 may also be adjustable using methodsand circuits detailed below in connection with FIG. 6.

FIG. 2 depicts a communication system 200 in accordance with anotherembodiment. System 200 has features in common with IC die 100 of FIG. 1,like-numbered elements being the same or similar. System 200 includesODT circuitry that can selectively introduce filter elements that may beuseful for low power configurations. Further, the selection can beaccomplished dynamically in some embodiments, which allows system 200 toselect appropriate ODT characteristics for high and low-frequencycommunication. This flexibility is useful for example in systems thatsupport both a low-frequency, power-saving mode and a high-frequency,high-performance mode.

System 200 includes a transmitter IC die 205 coupled to a receiver ICdie 210 via a single-ended communication port made up of pads 215, achannel 220, and related conductors on dies 205 and 210. Die 205includes a transmitter 225 and a pair of termination legs 230. Legs 230may be the same or similar to the termination legs detailed inconnection with the receiver dies 100 and 210 of FIGS. 1 and 2.Transmitter 225 conveys a signal TX to receiver 105 on die 210 via pad215 and the other elements of the associated communication port.

IC die 210 includes ODT circuitry 235 that can select either a filteredor unfiltered half-supply termination topology. The termination topologyis then left to the discretion of the user of IC die 210. The topologymay be fixed, defined at start up, or allowed to change dynamically tosupport different performance modes. In the depicted embodiment,termination select logic 240 issues a control signal L/H, the state ofwhich identifies either a lower-performance, lower-power mode, or ahigher-performance, higher-power mode.

ODT circuitry 235 includes two termination legs extending from thecommunication port between pad 215 and receiver 105 of die 210. Theupper termination leg includes a first termination impedance 245 and afirst termination switch 250. Switch 250 includes three switch nodes,two of which are connected to reference voltage Vref, one directly andthe other via a filter capacitor 255. The third switch node is coupledto the communication port via termination impedance 245. The lowertermination leg is substantially the same. The switches of the upper andlower termination legs are responsive to signal L/H from terminationselect logic 240.

The switches of both termination legs connect their respectivetermination resistors directly to voltage node Vref in ahigh-performance mode, and to voltage node Vref via a respective filtercapacitor in a low-frequency mode. Filtering the input signal in thelow-frequency mode advantageously dampens high-frequency noisecomponents. The filter capacitors may be adjustable in some embodimentsto allow filter tuning. Fixed or adjustable resistors in series and/orin parallel with the filter capacitors can also be included.

FIG. 3 depicts an IC die 300 in accordance with another embodiment. Die300 includes a receiver 305 that compares an input signal RXi with areference voltage Vref on a like-named voltage node to produce an outputsignal RXo. Die 300 also includes programmable ODT circuitry 310 thatcan be programmed to provide filtered or unfiltered rail-to-rail or ahalf-supply termination topologies, and thus combines the functionalityof the embodiments of FIGS. 1 and 2.

ODT circuitry 310 includes two termination legs. Each leg includesswitches 315 and 320, a filter capacitor 325, and a terminationimpedance 330. Switches 315 and 320 support four modes as follows:

-   -   1. Unfiltered Rail-to-Rail: Switches 320 are closed and switches        315 of the upper and lower termination legs select nodes Vodt        and Ground, respectively.    -   2. Filtered Rail-to-Rail: Switches 320 are open and switches 315        of the upper and lower termination legs select nodes Vodt and        Ground, respectively.    -   3. Unfiltered Half-Supply: Switches 320 are closed and switches        315 both select node Vref.    -   4. Filtered Half-Supply: Switches 320 are open and switches 315        both select node Vref.        ODT circuitry 310 can be adapted to support more modes.        Additional supply voltages can be supported, for example, and        the impedances and capacitances can be adjustable.

FIG. 4 depicts a communication system 400 that employs configurable ODTcircuitry in accordance with another embodiment. The configurable ODTcircuitry allows a transmitter die 405 to select between two or moretermination voltages when transmitting data to a receiver die 410 over adifferential communication channel 415. The resulting output common-modevoltage can thus be tailored to the needs of a receiver on die 410. If,for example, multiple receivers timeshare a common bus but require orbenefit from different receive termination voltages, then the associatedtransmitter or transmitters can use the termination voltage best suitedfor the receiver with which they are communicating. A communicationchannel may also support different operational modes that require orbenefit from different termination voltages. A transmitter might, forexample, support a loop-back communication mode for self test orinitialization that employs a first termination voltage, andadditionally support one or more operational modes that employ differenttermination voltages suitable for one or more target receivers.

Die 405 includes a differential transmitter with two identical or nearlyidentical termination legs. Each leg includes a fixed or adjustabletermination impedance 417 and a voltage-select switch 420. The state ofswitches 420 are controlled using select signal S that may be providedexternally or internally, as by a memory 425. Control logic can beincluded to dynamically alter the states of switches 420, which canalternatively select either of two termination voltages V1 and V2. Inother embodiments, a variable voltage source is used in lieu of switches420 and the two supply nodes.

FIG. 5 depicts a communication system 500 in accordance with yet anotherembodiment. Communication system 500 includes a transmitting die 505communicating with a receiving die 510 via a differential channel 515.The transmitting die includes differential output pads 513 coupled viathe channel to input pads 517 of the receiving die. In one embodiment,communication system 500 includes a transmitter 520 that employslow-voltage differential signaling (LVDS) for serial data transmissionto a corresponding receiver 525, though other types of signaling mayalso be used. System 500 optionally includes an external differentialtermination resistor 530 (in phantom).

Die 510 includes programmable ODT circuitry that can select from anumber of possible termination topologies. In support of thisselectivity, die 510 includes three termination legs that extend from acommon node 535, two to the differential input terminals to receiver 525and one to a reference voltage node, e.g. ground. Each of the first twotermination legs includes a termination impedance 540 and a switch 545connected in series. The third termination leg includes a capacitance550, a termination impedance 555, and a switch 560. The inclusion ofimpedances 540 and as associated switches 545 allows for the omission ofexternal resistor 530. The third leg allows for the selectiveincorporation of a noise-reducing RC filter. The impedances andcapacitance of the ODT circuitry of FIG. 5 are variable in someembodiments, which allows filter and termination values to be trimmedfor improved performance. Switches 545 and 560 can be controlled byexternal or internal control signals applied to switch control terminals(not shown). The various capacitive and resistive elements can besimilarly controlled.

FIG. 6 depicts a configurable RC circuit 600 that can be used in placeof the third termination leg of die 510 of FIG. 5, which extends betweennode 535 and ground. Circuit 600 includes some memory 605, the outputsof which are coupled to the control terminals of a plurality oftransistors 610. The transistors 610 selectively couple one or moredifferently sized capacitors 615 between node 535 and ground. Inaddition to controlling the capacitance, the resistance between nodes535 and ground can be adjusted by selecting various combinations oftransistors. The width-to-length ratios of transistors 610 may be variedto provide various impedances so that enabling different combinations oftransistors provides different levels of termination impedance.

In the foregoing description and in the accompanying drawings, specificterminology and drawing symbols are set forth to provide a thoroughunderstanding of the present invention. In some instances, theterminology and symbols may imply specific details that are not requiredto practice the invention. For example, the interconnection betweencircuit elements or circuit blocks may be shown or described asmulti-conductor or single conductor signal lines. Each of themulti-conductor signal lines may alternatively be single-conductorsignal lines, and each of the single-conductor signal lines mayalternatively be multi-conductor signal lines. Signals and signalingpaths shown or described as being single-ended may also be differential,and vice-versa. Similarly, signals described or depicted as havingactive-high or active-low logic levels may have opposite logic levels inalternative embodiments. As another example, circuits described ordepicted as including metal oxide semiconductor (MOS) transistors mayalternatively be implemented using bipolar technology or any othertechnology in which a signal-controlled current flow may be achieved.With respect to terminology, a signal is said to be “asserted” when thesignal is driven to a low or high logic state (or charged to a highlogic state or discharged to a low logic state) to indicate a particularcondition. Conversely, a signal is said to be “de-asserted” to indicatethat the signal is driven (or charged or discharged) to a state otherthan the asserted state (including a high or low logic state, or thefloating state that may occur when the signal driving circuit istransitioned to a high impedance condition, such as an open drain oropen collector condition). A signal driving circuit is said to “output”a signal to a signal receiving circuit when the signal driving circuitasserts (or de-asserts, if explicitly stated or indicated by context)the signal on a signal line coupled between the signal driving andsignal receiving circuits.

An output of a process for designing an integrated circuit, or a portionof an integrated circuit, comprising one or more of the circuitsdescribed herein may be a computer-readable medium such as, for example,a magnetic tape or an optical or magnetic disk. The computer-readablemedium may be encoded with data structures or other informationdescribing circuitry that may be physically instantiated as anintegrated circuit or portion of an integrated circuit. Although variousformats may be used for such encoding, these data structures arecommonly written in Caltech Intermediate Format (CIF), Calma GDS IIStream Format (GDSII), or Electronic Design Interchange Format (EDIF).Those of skill in the art of integrated circuit design can develop suchdata structures from schematic diagrams of the type detailed above andthe corresponding descriptions and encode the data structures oncomputer readable medium. Those of skill in the art of integratedcircuit fabrication can use such encoded data to fabricate integratedcircuits comprising one or more of the circuits described herein.

While the present invention has been described in connection withspecific embodiments, variations of these embodiments will be obvious tothose of ordinary skill in the art. For example, the embodiments can beadapted for use with various single-ended and differential communicationschemes over unidirectional and bidirectional channels. Specificexamples include Series Stub Terminated Logic (SSTL) anddouble-data-rate (DDR) signaling, though this is by no means anexhaustive list. Embodiments may also be used for channels employingvarious modulation schemes, including those that employmulti-pulse-amplitude-modulation (multi-PAM) and single-PAM signals.Moreover, some components are shown directly connected to one anotherwhile others are shown connected via intermediate components. In eachinstance the method of interconnection, or “coupling,” establishes somedesired electrical communication between two or more circuit nodes, orterminals. Such coupling may often be accomplished using a number ofcircuit configurations, as will be understood by those of skill in theart. Therefore, the spirit and scope of the appended claims should notbe limited to the foregoing description. Only those claims specificallyreciting “means for” or “step for” should be construed in the mannerrequired under the sixth paragraph of 35 U.S.C. § 112.

What is claimed is:
 1. An integrated-circuit (IC) die comprising: asignal pad coupled to receive a signal; a receiver having: an inputterminal coupled to the signal pad to receive the signal; a referenceterminal to receive a reference; and an output terminal to issue anoutput responsive to the signal and the reference; and first and secondtermination legs to support a first termination topology and a secondtermination topology, the first and second termination legs connectingthe input terminal to a first supply node and a second supply node,respectively, in the first termination topology and coupling the inputterminal to the reference terminal in the second terminal topology. 2.The IC die of claim 1, the first termination leg including a firsttermination impedance and the second termination leg including a secondtermination impedance.
 3. The IC die of claim 2, wherein the firsttermination impedance and the second termination impedance each connectdirectly to the input terminal.
 4. The IC die of claim 3, furthercomprising a first switch to selectively connect the first terminationimpedance to the first supply node and a second switch to selectivelyconnect the second termination impedance to the second supply node. 5.The IC die of claim 4, further comprising a memory coupled to the firstswitch and to the second switch, the memory to store a value controllingthe first switch and the second switch.
 6. The IC die of claim 5,further comprising a first capacitor between the first supply node andthe reference terminal and a second capacitor between the second supplynode and the reference terminal.
 7. The IC die of claim 1, wherein thereference terminal applies a reference voltage midway between a firstvoltage applied to the first supply node and a second voltage applied tothe second supply node.
 8. The IC die of claim 1, wherein the secondsupply node is at ground potential.
 9. An integrated circuit comprising:a signal pad to communicate a signal; and a receiver having: an inputterminal coupled to the signal pad to receive the signal; a referenceterminal to receive a reference; and an output terminal to issue anoutput responsive to the signal and the reference; and termination meansfor supporting a first termination topology and a second terminationtopology, the first termination topology connecting termination legsfrom the input terminal to supply nodes and the second terminationtopology connecting the termination legs between the input terminal andthe reference terminal.
 10. The integrated circuit of claim 9, thetermination legs including a first termination impedance and a secondtermination impedance.
 11. The integrated circuit of claim 10, whereinthe first termination impedance and the second termination impedanceeach connect directly to the input terminal.
 12. The integrated circuitof claim 11, further comprising a first switch to selectively connectthe first termination impedance to a first of the supply nodes and asecond switch to selectively connect the second termination impedance toa second of the supply nodes.
 13. The integrated circuit of claim 12,further comprising a memory coupled to the first switch and to thesecond switch, the memory to store a value controlling the first switchand the second switch.
 14. The integrated circuit of claim 13, furthercomprising a first capacitor between the first of the supply nodes andthe reference terminal and a second capacitor between the second of thesupply nodes and the reference terminal.
 15. The integrated circuit ofclaim 9, wherein the reference terminal applies a reference voltagemidway between a first voltage applied to a first of the supply nodesand a second voltage applied to a second of the supply nodes.
 16. Theintegrated circuit of claim 9, wherein one of the supply nodes is atground potential.
 17. The integrated circuit of claim 9, furthercomprising a coupling switch and a capacitance coupled in parallelbetween the signal pad and the input terminal, the coupling switch toselectively DC couple the signal pad to the input terminal.
 18. Theintegrated circuit of claim 9, the termination legs each furthercomprising a capacitor coupled in series between the input terminal andthe respective one of the supply nodes.
 19. The integrated circuit ofclaim 18, the termination legs each further comprising a switch coupledin parallel with the respective capacitor.
 20. A device comprising: areceiver having: an input terminal to receive a signal; a referenceterminal to receive a reference; and an output terminal to issue anoutput responsive to the signal and the reference; and a terminationcircuit supporting a first termination topology and a second terminationtopology, the first termination topology connecting termination legsfrom the input terminal to supply nodes and the second terminationtopology connecting the termination legs between the input terminal andthe reference terminal.